| We supply high quality semiconductor wafers sourced from leading manufacturers and suppliers of semiconductor materials, offering diversified and vast range of wafers such as Silicon wafers, Glass wafers, Sapphire wafers, SOI wafers, Germanium wafers and other wafers as well. |
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| All wafers are manufactured strictly according to standard operation procedures and available from stock or production. We at Medini Agencies are committed to meet and fulfill our customer’s requirements, either large or small quantities. |
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| Silicon Wafers |
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| Diameter: |
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2-Inch, 3-Inch, 100mm, 125mm, 150mm, 200mm, 300mm |
| Material: |
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Silicon with purity up to 11N |
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| Grade: |
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Prime, Test, Monitor, Dummy |
| Growth: |
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CZ, FZ, NTD |
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| Type: |
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P, N |
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| Dopant: |
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B, P, As, Sb |
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| Orientation: |
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100>, <111>, <110>, … |
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| Resistivity: |
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0.001 - >10.000 ohm-cm |
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| Thickness: |
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SEMI-Std. and special wafers ≥20μm |
| Surface finish: |
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As cut, lapped, etched, polished |
| Laser Mark: |
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“optional” SEMI or custom-made |
| Measurement: |
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Resistivity, Thickness, Diameter, TTV, STIR, Bow, Warp, Particle Count, Surface Roughness |
| Documents: |
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CofC & Inspection report |
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| Glass Wafers |
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| Diameter: |
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2-Inch, 3-Inch, 100mm, 125mm,150mm, 200mm, 300mm, etc |
| Material: |
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Borofloat 33 Schott©, Fused Silica Tosoh-ES©, Pyrex 7740 Corning©, B270 Schott©, BK7 Schott©, Eagle 2000 Corning©, Soda Lime©, Quartz Glass |
| Thickness: |
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≥120μm |
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| Surface finish: |
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SSP, DSP, etc. |
| Surface Quality: |
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MIL 80/50 MIL 60/40
MIL 40/20 MIL 20/10 MIL 10/5 |
| Surf. roughness: |
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≥6Å |
| Edge Profile: |
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SEMI-Std or custom-made |
| Cleanliness: |
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CRC 100 or SEMI cleaned |
| Measurement: |
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Thickness, Diameter, TTV,
Bow, Surface Roughness |
| Documents: |
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CofC & Inspection report |
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| Sapphire Wafers |
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| Diameter: |
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2-Inch, 3-Inch, 100mm, 125mm, 150mm, 200mm or custom-made |
| Material: |
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Al2O3, Kyropoloshigh purity 99.99-99.998% mono Crystalline Al2O3 |
| Orientation: |
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C-, R-, A- and M- Plane |
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| Surface finish: |
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Optical polished back- or front-side, epi-polished frontside & optical polished, backside, epi-polished frontside and fine grinded backside |
| Surf. Roughness: |
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Polished <5ÅFine Grounded <1μm |
| Laser Mark: |
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“optional” |
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| Edge Profile: |
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SEMI-Std. |
| Flats: |
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SEMI-Std. |
| Wafer cleaning: |
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CRC <A100 |
| Measurement: |
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Surface Roughness, TTV, Bow, Transparency, Crystal Quality, Orientation |
| Documents: |
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CofC & Inspection report |
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Silicon On Insulator
(SOI) Wafers
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| Diameter: |
3-Inch, 100mm, 125mm, 150mm, 200mm |
| Device-Layer: |
270nm - 100μm |
| Box-Layer: |
100nm - 10μm |
| Handle-Layer: |
300μm - 775μm |
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| • Thick-Film, Fusion-Bonding |
| • Epi-Layer-Transfer |
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| • Oxygen Implantation |
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Other wafers
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| III/IV Wafers: |
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GaAs, GaP, GaSb, InAs,
InP, InSb, etc. |
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| Germanium Wafers: |
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2-Inch, 3-Inch, 100mm
<100> and <111>
SSP & DSP |
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| LiNbO3 Wafers: |
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2-Inch, 3-Inch, 100mm
Thickness >300μm, DSP
Orientation: Y-, Z-, YZ-
and wafers with off-orientation |
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